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2. When soldering wire to the LED, use individual heat-shrink tubing to
insulate the exposed leads to prevent accidental contact short-circuit.
(Fig.2)
3. Use stand-offs (Fig.3) or spacers (Fig.4) to securely position the LED
above the PCB.
Lead Forming Procedures
1. Maintain a minimum of 2mm clearance between the base of the LED
lens and the first lead bend. (Fig. 5 and 6)
2. Lead forming or bending must be performed before soldering, never
during or after soldering.
3. Do not stress the LED lens during lead-forming in order to prevent
fractures in the epoxy lens and damage the internal structures.
4. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering. (Fig. 7)
6. Do not bend the leads more than twice. (Fig. 9)
7. After soldering or other high-temperature assembly, allow the LED
to cool down to 50°C before applying outside force (Fig. 10).In general,
avoid placing excess force on the LED to avoid damage. For any
questions please consult with Kingbright representative for proper
handling procedures.
Cleaning
1. Do not use harsh organic solvents such as trichloroethylene, acetone,
Chlorosen, and Diflon S3MC for cleaning because they may cloud or
damage the LED lens.
2. Isopropyl alcohol or deionized water are recommended solvents for
cleaning.
3. Special attention should be taken if other chemicals are used for
cleaning because other solvents may damage the epoxy in the lens
or housing.
4. The cleaning process should take place at room temperature and the
devices should not be washed for more than one minute.
5. When water is used for cleaning, immediately use forced-air drying to
remove excess moisture from the LED.
Miscellaneous Design Notes
1. Protective current-limiting resistors may be necessary to operate the
LEDs within the specified range.
2. LEDs mounted in parallel should each be placed in series with its own
current-limiting resistor.
0.5mm MIN
TECHNICAL NOTES
84
5. During lead forming, use tools or jigs to hold the leads securely so that
the bending force will not be transmitted to the LED lens and its internal
structures. Do not perform lead forming once the component has been
mounted onto the PCB. (Fig. 8)
TECHNICAL NOTES APPLICATION NOTES