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1. Reflow Soldering Profiles With Pb-Sn Solder
Recommended Reflow Soldering Profiles For
Kingbright SMD Products
No more than two soldering passes with the
recommended profile.
2. Lead-Free Reflow Soldering Profile
No more than two soldering passes with the
recommended profile.
InGaN/GaN products are sensitive to electrostatic discharge (ESD) and
other transient voltage spikes. ESD and voltage spikes can affect the
component's reliability, increase reverse current, and decrease forward
voltage. This may result in reduced light intensity or cause component
failure.
Kingbright InGaN/GaN products are stored in anti-static packaging for
protection during transport and storage. Please note the anti-static mea-
sures below when handling Kingbright InGaN/GaN products.
Static Electricity and Voltage Spikes in InGaN/GaN
Products
Design Precautions
Products using InGaN/GaN components must incorporate protection
circuitry to prevent ESD and voltage spikes from reaching the vulnerable
component.
ESD Protection During Production
Static discharge can result when static–sensitive products come in con-
tact with the operator or other conductors. The following procedures may
decrease the possibility of ESD damage:
1. Minimize friction between the product and surroundings to avoid
static buildup.
2. All production machinery and test instruments must be electrically
grounded.
3. Operators must wear anti-static bracelets.
4. Wear anti-static suit when entering work areas with conductive
machinery.
5. Set up ESD protection areas using grounded metal plating for
component handling.
6. All workstations that handle IC and ESD-sensitive components must
maintain an electrostatic potential of 150V or less.
7. Maintain a humidity level of 50% or higher in production areas.
8. Use anti-static packaging for transport and storage.
9. All anti-static equipment and procedures should be periodically
inspected and evaluated for proper functionality.
LED Mounting Method
1. The lead pitch of the LED must match the pitch of the mounting holes
on the PCB during component placement. Lead-forming may be
required to insure the lead pitch matches the hole pitch. Refer to
(Fig.1) for proper lead forming procedures.
Note 1-2 : Do not route PCB trace in the contact area
between the leadframe and the PCB to prevent short-
circuits.
TECHNICAL NOTES
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TECHNICAL NOTES APPLICATION NOTES